Southchip introduces SC3606 chip for controlling piezoceramic fans smaller than 1 mm in smartphones
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Pandaily
pandaily.com

Southchip introduces SC3606 chip for controlling piezoceramic fans smaller than 1 mm in smartphones

Southchip has released the SC3606 chip, designed to control piezoelectric fans. This type of active cooling is considered by the company to be ideal for thin gadgets such as smartphones. Currently, Southchip has not disclosed information about specific devices that will use this chip.

A piezoelectric fan is characterized by the absence of a motor, bearings, shaft, or mechanical friction. It consists of a thin membrane that vibrates at ultrasonic frequencies. Southchip claims that such fans can have a thickness of less than 1 mm, operate at a noise level of about 30 dB, consume hundreds of milliwatts of energy, and react in less than a millisecond.

The main challenge is that the piezoactuator cannot independently find its resonant point or regulate its own power consumption; it requires a driver capable of outputting high voltage, precisely locking onto resonance, and maintaining high efficiency.

Technical specifications and capabilities of the chip

The SC3606 comes in an FCQFN package measuring 2.3 mm by 2.75 mm and 0.5 mm thick, featuring 22 pins. It accepts an input voltage ranging from 2.1 V to 5.5 V, allowing it to be installed directly on the battery bus without needing an additional LDO or DC-DC converter at the front end. This range is also compatible with lower voltages of silicon-anode batteries.

The integrated bidirectional buck-boost circuit increases the output signal amplitude up to 46 Vpp, or plus-minus 23 V, within a frequency range of 2 kHz to 40 kHz.

A key feature is resonance tracking. Since the resonant point of the piezo fan changes due to individual device variations, mounting voltage, temperature, and aging, the chip combines full-range scanning and segmented approximate scanning with real-time frequency tracking. This allows it to autonomously find the optimal operating point within 15 kHz and 40 kHz. As a result, device manufacturers do not need to calibrate every batch of fans on the production line or implement temperature compensation.

The chip supports both sinusoidal and square wave control. Sinusoidal control, which has low harmonic content, ensures that the actuator vibrates only in the target mode, avoiding audible high-frequency whistling that harmonics might excite. Since the piezoelectric element functions like a large capacitor that charges and discharges with each cycle, the energy recovery architecture returns stored energy back to the power bus, thereby reducing the overall system power consumption.

The 1.2 V I2C interface allows the chip to connect directly to flagship SoCs and PMICs, enabling thermal management software to quickly activate and run the fan. Protection features include overvoltage protection, overheat protection, low voltage lockout, and short-circuit protection.

In conjunction with the previously released SC3601 driver for liquid cooling using a piezo micropump, the SC3606 offers device developers the choice among piezo-oriented cooling drivers from a single supplier.

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Samsung evaluates replacing Qualcomm chip with Exynos 2700 in Galaxy S27 Ultra due to temperature issues
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Samsung evaluates replacing Qualcomm chip with Exynos 2700 in Galaxy S27 Ultra due to temperature issues

Samsung is considering using the Exynos 2700 processor in the Galaxy S27 Ultra model, marking the return of the chip developed by the manufacturer itself in this flagship smartphone, after four generations using Qualcomm processors.

This potential change would arise due to temperature issues detected during tests conducted with the Snapdragon 8 Elite Extreme Gen 6. According to the South Korean newspaper SEDaily, Samsung has given Qualcomm until mid-October to present a solution before mass production of the new device begins.

The publication reports that Samsung had been testing the chip for over a month, and under more intensive workloads, it reached temperatures exceeding the limit established by the company. This situation can result in the phenomenon known as thermal throttling, where the system reduces the processor's frequencies and power consumption to prevent overheating when the temperature exceeds a certain threshold.

Initially, the plan was to use Exynos processors in the Galaxy S27, S27 Plus, and S27 Pro models (the latter version is speculated to have enhanced cameras and a smaller screen), keeping only the Snapdragon in the Ultra version.

An eventual transition would represent the end of a sequence that began with the Galaxy S23 Ultra. The Galaxy S22 was the last generation in which the most advanced model received Exynos processors in certain markets; since then, the company has exclusively adopted Snapdragon chips, including the current Galaxy S26 Ultra.

The Exynos 2700, presented as the alternative for the next line, is also manufactured using a 2-nanometer process. Previous information indicated that Samsung had implemented modifications to the encapsulation of this component aiming to optimize heat dissipation.

The alleged problems identified by Samsung echo reports from other devices already equipped with the Qualcomm SoC in China. As reported by Phone Arena, users have reported occurrences of black screens and restarts on some devices.

The portal observes that it is not possible to link these problems to the TSMC's 2nm manufacturing process, given that the A20 Pro, used in the iPhone 18 Pro, which uses the same lithography, shows no records of thermal instability. In addition to visual improvements and the processor, the new generation is expected to incorporate a new 200MP main sensor and enhancements to Privacy Screen technology.

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