Chinese robotics chip manufacturer Huixi Technology announced on October 22 that it has completed its Pre-Series B-plus and Series B funding rounds. The round was led by the Beijing Artificial Intelligence Industry Investment Fund.
The financing also involved the Beijing Robotics Industry Development Fund, Hidden Hill Capital, and other investors. Existing shareholders, including Shunwei Capital and Cathay Capital, also contributed investments.
The raised funds will be directed towards developing next-generation high-performance chips for embodied AI, as well as accelerating the commercial supply of products. The company is developing the R1 AI System-on-Chip and Huixi embodied computing platforms, which integrate processors with software for simulation, model deployment, and real-time control.
The company's current computing platform is already in use in AgiBot's Genie G2 robots. It is reported that Huixi's total equity financing this year exceeded 2.5 billion yuan.
