The Government of Odisha has approved the establishment of a National Center for Joint Development in Integrated Electronics, which will cost 452 crore rupees and be located at IIT Bhubaneswar. This was announced by Chief Minister Mohan Charan Majhi during the SEMICON India 2026 event in New Delhi on Friday.
This project will be implemented under the Indian Design, Semiconductors, Packaging, and Systems program and will be jointly funded by the Ministry of Electronics and Information Technology, the Government of Odisha, the Anusandhan National Research Foundation, and industry partners.
According to Majhi, this program involves creating industry-led centers of excellence aimed at bringing research and innovation closer to practical commercial application.
Currently, Odisha has approved five semiconductor manufacturing projects with a total capital investment of 10,899 crore rupees. These projects are expected to generate over 4,500 direct jobs and more than 16,000 indirect jobs. These projects cover areas such as silicon carbide-based semiconductors, advanced packaging, glass substrate packaging, memory module assembly, and power electronics.
Two of these projects were approved under the India Semiconductor Mission. SiCSem, an integrated device manufacturer, is building a silicon carbide-based semiconductor fabrication plant with packaging capabilities. Another company, Heterogeneous Integration Packaging Solutions, or HIPS/3DGS, is setting up an advanced glass substrate packaging facility intended for use in fields such as artificial intelligence, high-performance computing, and advanced processors.
Other investments mentioned include RIR Power Electronics for silicon carbide-based power devices, Sancode Technologies for advanced packaging, and ASP Semicon for memory module OSAT operations.
Majhi stated that RIR Power Electronics has completed the installation of reactors for producing epitaxial silicon carbide wafers at its Bhubaneswar facility, and commercial production is expected to begin soon. Furthermore, Odisha is negotiating to attract additional investments into the semiconductor sector.
The state is working to convert the Memorandum of Understanding with Intel-3DGS into investments in advanced glass substrates and packaging. Sancode is also discussing the possibility of a second phase for the advanced packaging facility. SiCSem is exploring a second phase that would include a silicon carbide and gallium nitride fabrication plant with packaging capabilities, while QuadQuantum is considering establishing a raw material facility for silicon carbide wafers.
Odisha's presentation at SEMICON India demonstrates that the total semiconductor investment portfolio is valued at approximately $4.7 billion, including $1.2 billion in current investments and $3.5 billion in planned investments.
Majhi also highlighted the incentive system offered by Odisha for the semiconductor sector. The state will provide additional financial support of up to 25% of eligible capital expenditure for projects approved under the India Semiconductor Mission. This support extends to semiconductor equipment manufacturing, semiconductor chemicals, gases, materials, and other parts of the supply chain.
The state's presentation also indicated that capital expenditure support of 30% is provided for certain fabs not included in the ISM, and ATMP/OSAT projects, while supply chain projects not related to the ISM receive 10% support. Odisha's policy on semiconductors now covers design, equipment, raw materials, chemicals, and gases, manufacturing, ATMP/OSAT, and research and development.
Majhi noted that the state's goal is to form semiconductor clusters rather than attracting individual projects, stating: 'A facility of this kind pulls along the entire supply chain.'
