Research indicates that over half of electronic product failures are caused by thermal problems resulting from increased chip junction temperature. As transistor density grows, power density increases, leading to significant heat dissipation. Today, the thermal design of the package has become a critical bottleneck determining the circuit's ability to conduct current and future integrated circuit developments.
Traditional packages, such as SOP, QFP, and QFN, primarily use leads and frames for heat dissipation. These designs have long thermal paths, high thermal resistance, and low efficiency, which prevents them from meeting the thermal requirements of medium and high power density devices, limiting their application to small, low-power components.
Compared to outdated solutions, FOPLP (Fan-Out Package with Leadframe) offers significant advantages: no substrate, high I/O density, short thermal path, and thin profile. Through coordinated optimization of material systems and package structure, a significant leap in heat dissipation performance is achieved. With excellent thermal and integration capabilities, FOPLP has broad prospects for application in high-tech fields, including automotive electronics, mobile terminals, and high-performance computing.
Proper thermal design requires a precise understanding of thermal parameters. In semiconductor packaging, there are numerous thermal metrics, such as thermal resistance and thermal characteristic parameters, which differ in physical value and application areas. A very common and detrimental engineering error is the incorrect use of these parameters, such as directly applying junction-to-case thermal resistance to estimate actual junction temperature. It is crucial to clearly distinguish the correct definitions, measurement conditions, and scope of application for each parameter according to JEDEC standards and official Texas Instruments technical documentation. Correctly understanding and differentiating these thermal parameters is a prerequisite for package selection, thermal solution design, and system thermal modeling.
Huatian Technology has developed a comprehensive thermal design and simulation analysis capability for Fan-Out (FO) packaging to address chip heat dissipation issues at the source. The company conducts systematic optimization by combining material selection, routing design, and package structure with multiphysics modeling, continuously improving the thermal efficiency and long-term reliability of FOPLP packaging. This allows for providing stable and reliable solutions for heat dissipation in high-power density chips.