Narendra Modi laid the cornerstone and unveiled a memorial plaque for the ASIP Technologies semiconductor manufacturing complex in Tarlavada, Vizagapatnam, on Saturday. This semiconductor assembly and testing (OSAT) project, valued at 250 billion rupees, is the first of its kind in Andhra Pradesh and South India approved under the India Semiconductor Mission (ISM 1.0).
Andhra Pradesh Governor N. Chandrababu Naidu joined the Prime Minister virtually during the foundation stone laying ceremony. The 30-acre complex, with initial investments exceeding 460 billion rupees, will have an annual production capacity of 96 million chips. The technological partner for the project is the South Korean company APACT Co.
The facility will serve fast-growing sectors such as artificial intelligence (AI), high-performance computing, data centers, and high-speed communication. ASIP also plans to expand production by investing an additional over 200 billion rupees to scale up advanced semiconductor packaging operations. The project is expected to provide over 1000 direct skilled jobs and 1600 indirect jobs.
Upon commissioning, ASIP will begin production using wire-bond and flip-chip ball grid array (BGA) packaging technologies, with plans to implement advanced 2.5D and 3D packaging capabilities within two to three years.
Modi's remarks on state development
In his speech, Modi highly praised Andhra Pradesh's IT talent pool, stating that the state is now well-equipped to lead in semiconductor manufacturing. He emphasized that the government intends to support this growing manufacturing story, which is a vital part of the Viksit Bharat mission.
Amitesh Kumar Sinha, CEO of the India Semiconductor Mission, commended ASIP for initiating the project, calling it a significant contribution to India's semiconductor mission. He noted that the advanced semiconductor packaging complex in Vizagapatnam represents a substantial step forward and confirms ISM's commitment to supporting the sector through industry-oriented growth policies.
Company leaders' statements
Venkata Simhadri, Managing Director and CEO of ASIP, stated that laying the foundation stone for the Vizagapatnam complex marks a major milestone for ASIP and its ambition to strengthen India's semiconductor manufacturing capabilities. He thanked the Government of India, MeitY, the India Semiconductor Mission (ISM), and the Government of Andhra Pradesh for their support and trust in the project. He added that together with partner APACT, they are creating advanced assembly, packaging, and testing capabilities in India, fostering skill development, supply chain localization, and the growth of the Andhra Pradesh semiconductor ecosystem.
Song Dong Lee, CEO and President of APACT, noted that the semiconductor industry increasingly requires resilient and diversified supply chains. He emphasized that the partnership with ASIP merges Korean technological expertise with India's engineering talent and manufacturing ambitions. In his view, this facility will be a crucial part of the India Semiconductor Mission and the global semiconductor ecosystem, providing advanced packaging and testing solutions to customers worldwide.
Currently, India imports almost all semiconductor chips used in its electronics industry. The OSAT complex addresses a critical bottleneck in the country's semiconductor value chain, where packaging and testing account for about 30-40 percent of chip production costs.
The company aims to localize a significant portion of its supply chain over the next three to five years by establishing partnerships with academic institutions, including the Indian Institute of Technology (IIT) Tirupati and IIT Hyderabad. The complex will also feature an in-house semiconductor training center designed to prepare a skilled workforce for India's growing semiconductor sector. Environmental solutions, such as solar power generation and water recycling systems, will be integrated into the project to create a high-standard and environmentally responsible manufacturing operation.